Another big change called RibbonFET that’s coming with Arrow Lake should offer further advantages.
“Everybody’s going to follow suit and will have the same technology in place over time.”
Backside power delivery originated atImec, a Belgian research labfunded by several chipmakers to develop new technology.
It works well enough that it’ll be standard for Intel 20A and its successor, 18A.
PowerVia is a crucial element to Intel’s recovery effort.
Although Samsung and TSMC are working on backside power delivery, PowerVia could beat it to market.
For example,TSMC’s backside power technology isn’t expected until 2026.
A node is a major step in chip manufacturing technology.
PowerVia adds new processing steps to the hundreds already required to make a chip.
That adds cost and time.
